Universal PCB and smart card using the same

ABSTRACT

A smart card is provided including a body with a cavity, an IC chip inserted into the cavity, and a universal PCB on which the IC chip can be mounted and electrically contacted regardless of its size, type and bonding structure. The universal PCB comprises groups of contact pads suitable for contacting IC chips of different sizes and designs.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from Korean Patent Application No.10-2005-0063755, which was filed on 14 Jul. 2005. The disclosure ofKorean Patent Application No. 10-2005-0063755 is incorporated byreference in its entirety.

BACKGROUND

1. Technical Field

The disclosure relates to a smart card, and more particularly, to auniversal printed circuit board (PCB) that can be used suitably for thevarious positions of chip pads, regardless of the size, type and bondingstructure of an integrated circuit (IC) chip, and a smart card using theuniversal PCB.

2. Description of the Related Art

Smart cards or IC cards are used as microprocessor-carrying units. Thesmart card preferably means a card into which an IC is inserted. Thesmart card includes an IC processor, a small-capacity memory, and aninterface card.

A smart card module inserted into most smart cards includes a PCB onwhich an IC chip is mounted. The IC chip is mounted on one side of thePCB, and the other side of the PCB is equipped with ISO 7816-2 externalcontact pads. The external contact pads include a total of 8 padsdefined in the ISO 7816-2 standard.

In general, the IC chip is first mounted on the PCB of the smart cardmodule according to a chip-on-board (COB) package technique, and thenthe smart card module is inserted into the cavity of the body of thesmart card.

The number of connection pads for connecting the IC chip to the PCB isvaried according to the type, size and/or bonding structure (orelectrical assembly structure) of the IC chip. The relative position ofthe connection pads with respect to the PCB may also be varied accordingto the structure of the IC chip. Accordingly, a given IC chip designrequires a dedicated PCB that is designed for pad positions specific tothe type, size and/or bonding structure of the IC chip.

However, as the use of smart cards is extended into various fields,various IC chip designs are used for incorporation into the smart cards.Further, the method of mounting the IC chip on the PCB is also varied.Accordingly, it becomes difficult and expensive to design andmanufacture the dedicated PCBs. These effects tend to prevent the massproduction of the smart cards.

In order to reduce the manufacturing cost for the smart card product, amass production method capable of reducing the unit cost of a componentof the smart card product is required. However, when the dedicated PCBssuitable for the respective IC chips or the mounting structures thereofare used, it is difficult to manufacture the smart card products throughthe mass production method.

Consequently, a universal PCB that can be used suitably for various chippad positions regardless of the size, type and bonding structure of theIC chip, and/or the number of the chip pads is required.

SUMMARY

Embodiments of the invention provide a smart card with a cavity intowhich an IC chip mounted on a universal PCB is inserted. The universalPCB is provided in such a way that the IC chip can be mounted to the PCBregardless of the size, type or bonding structure of the IC chip.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the invention will becomemore apparent by describing in detail exemplary embodiments thereof withreference to the attached drawings.

FIG. 1A is a sectional view of a smart card module in which an IC chipis mounted on a universal PCB by wire bonding according to an embodimentof the invention.

FIG. 1B is a sectional view of a smart card module in which an edge padtype IC chip is mounted on a universal PCB by flip-chip bondingaccording to an embodiment of the invention.

FIG. 1C is a sectional view of a smart card module in which a center padtype IC chip is mounted on a universal PCB by flip-chip bondingaccording to an embodiment of the invention.

FIGS. 2A through 2C are plan views illustrating circuit patternsdesigned on a universal PCB according to an embodiment of the invention.

FIGS. 3A and 3B are plan views illustrating the positions of connectionpads for connecting an IC chip to a universal PCB according to anembodiment of the invention.

FIG. 4 is a plan view illustrating circuit patterns designed on auniversal PCB having antenna connection pads according to an embodimentof the invention.

FIGS. 5A through 5I are plan views illustrating various structures inwhich IC chips are mounted on antenna connection pads according to anembodiment of the invention.

FIG. 6 is a sectional view of a smart card according to an embodiment ofthe invention.

DETAILED DESCRIPTION

The invention will now be described more fully with reference to theaccompanying drawings, in which exemplary embodiments of the inventionare shown. The invention may, however be embodied in many differentforms and should not be construed as being limited to the embodimentsset forth herein; rather, these embodiments are provided so that thisdisclosure is thorough and complete, and fully conveys the inventiveprinciples found in embodiments of the invention to those skilled in theart.

When an IC chip is bonded to a PCB, the relative positions of chip padswith respect to the PCB are varied according to the type, size, bondingstructure, and/or the number of chip pads on the IC chip. The inventionprovides a smart card including a universal PCB having a plurality ofconnection pads corresponding to various positions of chip pads, onwhich a chip can be mounted regardless of its type, size, bondingstructure and the number of its chip pads. The invention provides auniversal PCB having internal connection pads that are formed on onesurface of the PCB at positions corresponding to the chip pads which canbe electrically connected to the chip pads.

Each of the internal connection pads may be electrically connected toone of the chip pads and the internal connection pads are provided inarrangements suitable for handling variation in the relative positionsof the chip pads. Accordingly, a specific chip pad can be electricallyconnected or wire-bonded to one of the internal connection pads,regardless of a change in the relative positions of the chip pads.

The internal connection pads are disposed at different positions on thePCB to be electrically connected to the corresponding chip pads.Further, several internal connection pads form an internal connectionpad group with each internal connection pad within and internalconnection pad group suitable for the same electrical connection.Accordingly, it can be understood that internal connection pad groupsare also disposed on the PCB.

The internal connection pad groups are disposed on one surface of thePCB. External contact pads are disposed on the opposite surface of thePCB, and the external contact pad and any one of the internal connectionpads are electrically connected by a connection via penetrating the PCB.An external circuit pattern includes the external contact pads, and thedisposition of the pads may be determined according to the ISO 7816-2standard.

The external circuit pattern may be designed to include a total of eightindependent external contact pads according to the ISO 7816-2 standard.The eight independent external contact pads may include a pad for Vccpower supply, a pad for a reset signal RST, a pad for a clock signalCLK, an RFU (reserved for future use) pad under the ISO/IEC 7816standard, a pad for Vpp (programming voltage) power supply, a data I/Opad, and other RFU pads.

A group of internal connection pads are electrically connected to eachof the external contact pads by a connection via. Each internalconnection pad of a group of internal connection pads is electricallyconnected to the other internal connection pads in the group by aninternal connection line. Also, a group of internal connection pads areelectrically isolated from another group of internal connection pads.The internal circuit pattern including these internal connection padsgroups is disposed on the opposite surface of the PCB with respect tothe external circuit pattern.

The smart card is electrically connected to the external contact pads tocommunicate data with the external circuit. For wireless datacommunication by radio frequencies, an antenna may be introduced intothe internal circuit pattern or the card body.

When the antenna is introduced into the internal circuit pattern, anantenna pattern may be introduced surrounding a region in which theinternal connection pads and the connection lines are disposed. When anexternal antenna is introduced into the card body, an external antennapad for electrical connection to the external antenna may be introducedonto the surface of the PCB upon which the internal connection pads andthe connection lines are disposed.

Preferably, the external antenna pad is exposed to the outside when theIC chip is mounted on the PCB and is then encapsulated by anencapsulation material. When a smart card module formed by mounting theIC chip on the PCB is inserted into a cavity of the card body, theexternal antenna pad contacts with the external antenna exposed insidethe cavity.

The disposition of the chip pads in the IC chip can be classified intotwo types; an edge-pad type where the chip pads are disposed at an edgeportion of the IC chip and a center-pad type where the chip pads aredisposed at a center portion of the IC chip.

In the universal PCB according to the invention, the internal connectionpad group may include an internal connection pad for the edge pad and aninternal connection pad for the center pad, which are electricallyconnected to each other. Accordingly, the universal PCB can be used forboth the edge-pad type IC chip and the center-pad type IC chip.

Either a wire bonding method or a flip-chip bonding method may be usedto mount and electrically connect the IC chip on the PCB. When comparingthe wire bonding method with the flip-chip bonding method, the IC chipis bonded in an upside-down manner. Therefore, the position of aspecific chip pad is reversed left and right in the two bonding methods.

In the universal PCB according to the invention, a wire-bonding internalconnection pad and a flip-chip bonding internal connection pad aredisposed at the left and right of the PCB, respectively, and areelectrically connected to each other. Accordingly, the universal PCB canbe used for both the edge-pad type IC chip and the center-pad type ICchip.

When the smart card uses an antenna, at least five chip pads may beelectrically connected to the respective internal connection pad groups.For example, two pads connected to the antenna, an RST pad, a CLK pad,and a Vcc pad may be electrically connected to the respective internalconnection pad groups. In this case, since the internal circuit patternhas both an internal antenna pattern and an external antenna padconnected to an external antenna, the external antenna or the internalantenna pattern may be used as an antenna.

Since the internal connection pad group of the internal circuit patternincludes the connection pads disposed corresponding to the chip pads,the universal PCB can be used regardless of the size, type and bondingstructure of the IC chip.

FIGS. 1A through 1C are sectional views of a smart card module in whichan IC chip is mounted on a universal PCB according to an embodiment ofthe invention. FIGS. 2A through 2C are plan views illustrating circuitpatterns designed on a universal PCB according to an embodiment of theinvention. FIGS. 3A and 3B are plan views illustrating the positions ofconnection pads for connecting an IC chip to a universal PCB accordingto an embodiment of the invention.

Referring to FIGS. 1A through 1C, a smart card according to anembodiment of the invention may include a smart card module installed inits body. The smart card module may include a PCB 100, and an edge-padtype IC chip 500 or a center-pad type IC chip 501 mounted on the PCB100.

The edge-pad type IC chip 500 may be mounted on the PCB 100 by wirebonding as illustrated in FIG. 1A, or the edge-pad type IC chip 500 maybe mounted on the PCB 100 by flip-chip bonding as illustrated in FIG.1B. The edge-pad type IC chip 500 may have chip pads 511 and 513arranged at its edge portion as illustrated in FIG. 3A.

Also, the center-pad type IC chip 501 may be mounted on the PCB 100 byflip-chip bonding as illustrated in FIG. 1C. The center-pad type IC chip501 may have chip pads 550 arranged at its center portion as illustratedin FIG. 3B. The center-pad type IC chip 501 is advantageous in that itcan be smaller than the edge-pad type IC chip 500.

Referring to FIGS. 2A through 2C, the PCB 100 has an external circuitpattern 200 formed on one surface and an internal circuit 300 formed onthe opposite surface. The circuit pattern 200 and 300 are designed suchthat they can be used regardless of the types and bonding structures ofthe IC chips 500 and 501. The circuit patterns 200 and 300 may include aconductive layer (e.g., a copper layer), and the conductive layer may beplated with nickel and/or gold.

As illustrated in FIG. 2B, the external circuit pattern 200 may bedesigned to include external contact pads 210 and external antennacontact pads 250 for the external contact of an antenna pattern. Theexternal contact pads 210 may be disposed according to the ISO 7816-2standard, and the external antenna contact pads 250 may be disposedoutside the external contact pads 210.

As illustrated in FIG. 2C, the internal circuit pattern 300 may includeinternal connection pads 301, 303 and 305 that are electricallyconnected to the IC chip 500 or 501. Also, the internal circuit pattern300 may include an internal connection line for connecting the internalconnection pads 301, 303 and 305 on a group basis, and a pair ofexternal antenna pads 399 that are intended to contact with the externalantenna. Preferably, the external antenna pads 399 are disposed outsidea region in which the internal connection pads 301, 303 and 305 aredisposed, so that they are contact-connected to the external antennawhen the PCB is inserted into the body of the smart card.

Also, the internal circuit pattern 300 may include a pair of internalantenna patterns 309 that are formed to surround the region in which theinternal connection pads 301, 303 and 305 are disposed. The PCB 100 canbe utilized in applications where an external antenna is used and inapplications where the internal antenna patterns 309 are used as anantenna.

The external circuit pattern 200 and the internal circuit pattern 300are electrically connected by connection vias 400 that penetrate the PCB100. The internal connection pads 301, 303 and 305 of each internalconnection pad group are electrically connected by the internalconnection line 307. Accordingly, when the internal connection pad 301and the external contact pad 210 are connected by the connection via400, the internal connection pads 303 and 305 are thereby alsoelectrically connected to the corresponding external contact pad 210.

Since the external antenna pad 399 can be connected to the externalcontact pad 250 by the connection via 400, separate connection vias maynot be provided to the internal connection pads 301, 303 and 305 in theinternal connection pad group for the external antenna pad that isprovided to electrically connect the external antenna pad 399 and thechip pads 511, 513 and 550.

So that the PCB 100 can be universally used to mount the IC chip 500 orthe IC chip 501, which are of different types, the PCB 100 includes theinternal connection pads 301, 303 and 305 that are located correspondingto the chip pads 511, 513 and 550 whose positions are varied accordingto the types and bonding structures of the IC chips 500 and 501.

It can be understood that a plurality of the internal connection pads301, 303 and 305 disposed at different positions on the PCB 100 areelectrically connected into one group by the internal line 307 toconstitute a circuit pattern.

For example, as illustrated in FIGS. 2A and 2C, the internal circuitpattern 300 includes groups of the internal connection pads 301, 303 and305. As illustrated in FIGS. 1A through 1C, each of the internalconnection pad groups may include the first, second and third internalconnection pads 301, 303 and 305 corresponding to the chip pads 511, 513and 550, which have substantially the same function but have differentrelative positions with respect to the PCB 100, and the internalconnection line 307 connecting the pads 301, 303 and 305.

The number of the internal connection pad groups may be determinedaccording to the number of the external contact pads 210. When anexternal antenna is used, the internal circuit pattern 300 may includeanother pair of internal connection pad groups intended to be connectedto the external antenna.

The internal connection pad groups are electrically isolated from oneanother, and at least one pad group is disposed at a positionsubstantially corresponding to the external contact pad 210. Forexample, four upper groups 310, 320, 330 and 340 and four lower groups350, 360, 370 and 380 may be disposed at vertically-symmetricalpositions.

The internal connection pad groups 390 for connecting an externalantenna may be disposed in a pair at vertically-symmetrical positions atthe left or right side of the PCB 100.

The internal connection pads 301, 303 and 305 are disposed at differentpositions in the upper group 310. For example, when the edge-pad type ICchip 500 is wire-bonded to the PCB 100, the first internal connectionpad 301 is disposed near the corresponding chip pad 511. Accordingly, itcan be understood that the first internal connection pad 301 acts as awire-bonding pad. The second internal connection pad 303 acts as a padelectrically connected to the chip pad 511 (FIG. 1B) performing the samefunction. When the IC chip 500 is flip-chip-bonded on the PCB 100 in anupside-down manner as illustrated in FIG. 1B, the second internalconnection pad 303 is disposed at a contact position with respect to thechip pad 511. Accordingly, the second internal connection pad 303 actsas a flip-chip-bonding pad. Since the flip-chip bonding requires asmaller pad area than the wire bonding, the second internal connectionpad 303 may be designed to have a smaller line width than the firstinternal connection pad 301.

When the bonding structure is changed from the wire bonding to theflip-chip bonding, the relative position of the chip pad 511 withrespect to the PCB 100 is changed from side to side. Accordingly, thefirst internal connection pad 301 and the second internal connection pad303 are disposed at horizontally-opposite sides. Since the contactpositions are different in the wire bonding structure and the flip-chipbonding structure, the second internal connection pad 303 are designedto be disposed more inward than the first internal connection pad 301toward the center of the internal circuit pattern 300. A bonding wire530 may have a more outward contact position in the wire bondingstructure than in the flip-chip bonding structure, as illustrated inFIGS. 1A and 1B.

The third internal connection pad 305 acts as a pad electricallyconnected to the chip pad 550 (FIG. 1C) performing the same function. Inthe case of the center-pad type IC chip 501 having the center chip pads550 as illustrated in FIG. 1C, the third internal connection pad 305acts as a pad for bonding the IC chip 501 to the center chip pad 550.Since the center-pad type IC chip 501 can also be flip-chip-bonded onthe PCB 100, the third internal connection pad 305 can be designed tohave a smaller line width than the first internal connection pad 301 asillustrated in FIG. 2C.

Since the center chip pads 550 are located at a substantially centerportion of the IC chip 501, the third internal connection pad 305 isdisposed in a line with the third internal connection pads 305 of theother groups.

The first, second and third internal connection pads 301, 303 and 305are electrically connected to the internal connection line 307. In orderfor the internal connection pad groups to be electrically isolated fromone another, the internal connection line 307 may have abranched-structure as in the third group 330, a straight-line structureas in the seventh group 370, a structure without a branch line as in thesecond group 320, or a structure surrounding the periphery of the firstinternal connection pads 301 of the other groups as in the first group310.

As a result, the IC chips 500 and 501 can be mounted on the PCB 100,regardless of their types, sizes and bonding structures.

As illustrated in FIG. 1A, the chip pad 511 of the IC chip 500 may bewire-bonded to the first internal connection pad 301. The first internalconnection pad 301 may be connected through the connection via 400 tothe external circuit pattern 200 including the external contact pad. Inthis wire bonding structure, an encapsulation material 600 may be moldedto protect the bonding wire 530. The encapsulation member 600 may bemolded to expose the external antenna pad 399 (FIG. 2C).

As illustrated in FIG. 1B, the chip pad 511 or a bump of the IC chip 500may be flip-chip-bonded to the second internal connection pad 303. Thesecond internal connection pad 303 may be connected to the firstinternal connection pad 301 and the internal connection line 307, andthen be connected through the connection via 400 to the external circuitpattern 200. In this flip-chip bonding structure, an encapsulationmaterial 610 may be injected between the IC chip 500 and the PCB 100 toprotect the flip-chip-bonded portion. The encapsulation material 610 maybe injected so as to expose the external antenna pad 399 (FIG. 2C).

As illustrated in FIG. 1C, the chip pad 550 or a bump of the center-padtype IC chip 501 may be flip-chip-bonded to the third internalconnection pad 305. The third internal connection pad 305 may beconnected to the first internal connection pad 301 and the internalconnection line 307, and then be connected through the connection via400 to the external circuit pattern 200. In this flip-chip bondingstructure, an encapsulation material 610 may be injected between the ICchip 501 and the PCB 100 to protect the flip-chip-bonded portion. Theencapsulation material 610 may be injected so as to expose the externalantenna pad 399 (FIG. 2C).

The PCB 100 may include the internal antenna pattern 309 (FIG. 2C) fordata communication and the external antenna pads 399 to be connected tothe external antenna. Accordingly, the internal circuit pattern 300 mayinclude the internal connection pad groups for connecting the externalantenna pads 399 and/or the internal antenna pattern 309 to the chippads 511 or 550.

FIG. 4 is a plan view illustrating circuit patterns that are designed ona universal PCB having antenna connection pads according to anembodiment of the invention.

Referring to FIG. 4, an internal circuit pattern 300 on the PCB 100(FIG. 1A) may include an internal antenna pattern 349 and/or theexternal antenna pads 399 to be connected to the external antenna. Theinternal circuit pattern 300 will now be described in detail, focusingon its structure for connection with the antenna.

In the internal circuit pattern 300, some of the internal connectionpads 301, 303 and 305 and the internal connection lines 307 can be usedto electrically connect the chip pad 511 or 550 and the linear internalantenna pattern 349 formed to surround the periphery of a region inwhich the internal connection pads 301, 303 and 305 are disposed. Thatis, a fourth internal connection pad group 340 may be used forconnection with the internal antenna pattern 349.

Accordingly, the fourth inner antenna connection pad group 340 mayinclude a first internal connection pad 341 for first wire bonding, asecond pad 343 for flip-chip bonding connected to the first internalconnection pad 341 by the internal connection line 307, and a third pad345 for center pad bonding.

The fourth antenna connection pad group 340 may further include a firstinternal connection pad 342 that is disposed at a horizontally-oppositeposition of the first internal connection pad 341 and is connected tothe other portion of the internal antenna pattern 349. Accordingly, whenthe IC chip 500 is wire-bonded on the PCB 100, an antenna signal line L1(or L2) can be wire-bonded to the left or right side of the IC chip 500.The first internal connection pad 341 can be electrically connectedthrough the connection via 400 to the external circuit pattern 200.

In the internal circuit pattern 300, some of the internal connectionpads 301, 303 and 305 and the internal connection lines 307 can be usedto electrically connect the chip pad 511 or 550 to the external antennapad 399. For example, a first internal connection pad 391 for wirebonding, a second pad 393 for flip-chip bonding, a third pad 395 forcenter pad bonding, and the internal connection line 397 thatconstitutes the ninth internal connection pad group 390 (FIG. 2C), canbe used as an external antenna connection pad group 390 for connectingthe chip pad 511 or 550 to the external antenna pad 399.

An antenna pad 399 connected to the external antenna connection padgroup 390 can be electrically connected to the external contact pad 250by the connection via 400. When the smart card module having the IC chip500 and the PCB 100 is inserted into the cavity of the smart card body,the external antenna pad 399 can be contact-connected to the externalantenna buried in the smart card body.

The external antenna pad 399 and the internal connection pad group 390connected to the pad 399 are formed in a pair in avertically-symmetrical structure as illustrated in FIG. 4.

As described above, the internal circuit pattern 300 of the PCB 100includes the internal antenna pattern 349, the internal connection padgroup 340 connected to the pattern 349, the external antenna pad 399,and the external antenna connection pad group 390 connected to the pad399, thereby enabling the wireless data communication.

Various chips (such as the IC chips 500 and 501) with various structurescan be mounted on the universal PCB 100 that is equipped with theinternal circuit pattern 300 including the internal connection padgroups located at different positions as illustrated in FIGS. 2A through2C.

FIGS. 5A through 5I are plan views illustrating various structures inwhich IC chips are mounted on the internal circuit pattern accordingsome embodiments of the invention.

FIG. 5A illustrates a structure in which the edge-pad type IC chip 500is wire-bonded to the internal circuit pattern 300 of the PCB 100.Referring to FIG. 5A, the chip pad 511 of the IC chip 500 can beelectrically connected to a first internal connection pad 301 of theinternal circuit pattern 300 by the bonding wire 530. The first internalconnection pad 301 is designed such that it is exposed outside a regionof the IC chip 500. A right chip pad 513 is bonded to the first internalconnection pad 301 by the bonding wire 530.

FIG. 5B illustrates a structure in which the IC chip 500 isflip-chip-bonded to the internal circuit pattern 300 of the PCB 100.Referring to FIG. 5B, the chip pad 513 or the bump of the IC chip 500can be flip-chip-bonded to a second internal connection pad 303 of theinternal circuit pattern 300. The second internal connection pad 303 islocated corresponding to a left chip pad 511 but is electricallyconnected to the first internal connection pad 301 by the internalconnection line 307 as indicated by a dotted line. This structure can beunderstood as being equivalent to the structure in which the right chippad 513 is electrically connected to the internal connection pad 301 bythe bonding wire 530 as illustrated in FIG. 5A.

As illustrated in FIGS. 5A and 5B, the universal PCB 100 can be used forboth the flip-chip bonding structure and the wire bonding structure.FIG. 5C illustrates a structure in which the IC chip 500 isflip-chip-bonded to the internal circuit pattern 300 of the PCB 100 anda connection to an antenna is formed to the left side.

Referring to FIG. 5C, a connection L1 (or L2) to the antenna is formedin such a way that the second internal connection pad 343, which isdisposed at the left of the internal antenna connection pad group 340and is connected to the internal antenna pattern 349, isflip-chip-bonded to the chip pad 511. The second internal connection pad343 is connected to the internal connection pattern 349 through thefirst pad 341.

FIG. 5D illustrates a structure in which the IC chip 500 is wire-bondedto the internal circuit pattern 300 of the PCB 100. Referring to FIG.5D, the chip pad 511 of the IC chip 500 can be electrically connected tothe first internal connection pad 301 of the internal circuit pattern300 by the bonding wire 530. The antenna connection L1 is formed in sucha way that the first wire bonding internal connection pad 341, which isdisposed at the left of the internal antenna connection pad group 340and is connected to the internal antenna pattern 349, is connected tothe chip pad 511 by the bonding wire 530. The antenna connection L2 isalso formed to be vertically symmetrical with respect to the antennaconnection L1.

FIG. 5E illustrates a structure in which the IC chip 500 is wire-bondedto the internal circuit pattern 300 of the PCB 100. Referring to FIG.5E, the antenna connection L1 is formed in such a way that the secondwire bonding internal connection pad 342, which is disposed at the rightof the internal antenna connection pad group 340 and is connected to theinternal antenna pattern 349, is connected to the chip pad 511 by thebonding wire 530. The antenna connection L2 is also formed to bevertically symmetrical with respect to the antenna connection L1.

FIG. 5F illustrates a structure in which the IC chip 500 is wire-bondedto the internal circuit pattern 300 of the PCB 100 and the antennaconnection L1 is formed to the right side of the IC chip 500. Referringto FIG. 5F, the antenna connection L1 is formed in such a way that thefirst internal connection pad 391 of the external antenna connection padgroup 390, which is connected to the external antenna pad 399, isconnected to the chip pad 511 by the bonding wire 530. The antennaconnection L2 is also formed to be vertically symmetrical with respectto the antenna connection L1.

FIG. 5G illustrates a structure in which the IC chip 500 isflip-chip-bonded to the internal circuit pattern 300 of the PCB 100 andthe antenna connection L1 is formed to the right side of the IC chip500. Referring to FIG. 5G, the antenna connection L1 is formed in such away that the second internal connection pad 393 of the external antennaconnection pad group 390, which is connected to the external antenna pad399, is flip-chip-bonded to the chip pad 511. The antenna connection L2is also formed to be vertically symmetrical with respect to the antennaconnection L1.

FIG. 5H illustrates a structure in which the center-pad type IC chip 501is flip-chip-bonded to the internal circuit pattern 300 of the PCB 100.Referring to FIG. 5H, the chip pads 550 are respectivelyflip-chip-bonded to the third internal connection pads 305. At thispoint, all of the third internal connection pads 305 may be used.

FIG. 5I illustrates a structure in which the center-pad type IC chip 501is flip-chip-bonded to the internal circuit pattern 300 of the PCB 100.Referring to FIG. 5I, the chip pads 550 are respectivelyflip-chip-bonded to the third internal connection pads 305. At thispoint, only five of the eight third internal connection pads 350 areused. That is, FIG. 5I illustrates a case where the connection to theantenna is not used.

As illustrated in FIGS. 5A through 5I, the PCB 100 can be universallyused regardless of the size, type and bonding structure of the IC chip.

FIG. 6 is a sectional view of a smart card according to some embodimentsof the invention.

Referring to FIG. 6, a smart card is constructed in such a way that asmart card module is formed by mounting the IC chip 500 or 501 on thePCB 100 as illustrated in some of FIGS. 5A through 5I and is theninserted into a cavity 701 in a card body 700. At this point, theexternal antenna pad 399 can be contact-connected to an external antenna750 buried in the card body 700. Although FIG. 6 illustrates a casewhere the flip-chip bonding is used to mount the IC chip 500 on the PCB100, the wire bonding and the center pad bonding can also be used toform the smart card module as illustrated in FIGS. 1A and 1C.

As described above, the universal PCB according to the invention can beused suitably for the various positions of the chip pads, regardless ofthe size, type and bonding structure of the IC chip.

Also, since the internal circuit pattern connected to the IC chip of thePCB further includes the internal antenna patterns and/or the externalantenna pads, and the internal connection pad groups intended to beelectrically connected to the internal antenna patterns or the externalantenna pads, the antenna can be selectively connected to the right orleft side of the IC chip according to the type and bonding structure ofthe IC chip.

Accordingly, it is possible to produce various smart cards in bulk ormass, thereby reducing the manufacturing cost thereof.

The invention may be practiced in many ways. What follows are exemplary,non-limiting descriptions of some embodiments of the invention.

According to some embodiments of the invention, there is provided asmart card including: a card body having a cavity; an IC chip insertedinto the cavity; and a PCB configured to mount the IC chip. The PCB mayinclude: a board body having an inner surface configured to mount the ICchip and an outer surface opposite to the inner surface; an internalcircuit pattern formed on the inner surface; an external connectionpattern including external contact pads formed on the outer surface; andconnection vias each penetrating the board body to connect one of theexternal contact pads and the internal circuit pattern.

The internal circuit pattern may include a plurality of internalconnection pad groups each including: internal connection pads locatedat a plurality of different positions on the inner surface in such a wayas to be electrically connected to chip pads of the IC chip regardlessof a change in positions of the chip pads; and an internal connectionline connecting the internal connection pads in a group.

The internal connection pads may be located outside a periphery of theIC chip to be wire-bonded to the chip pad when the IC chip iswire-bonded to the internal circuit pattern.

The internal connection pads may be located so as to be flip-chip-bondedto the chip pad when the IC chip is flip-chip-bonded to the internalcircuit pattern.

The chip pad may be a center pad located at a center portion of the ICchip, and the internal connection pads may be located at a centerportion of the internal circuit pattern in such a way as to correspondto the center pad.

The chip pad may be an edge pad located at an edge portion of the ICchip, and one of the internal connection pads may be locatedcorresponding to an edge portion of the IC chip in such a way as tocorrespond to the edge pad.

The internal circuit pattern may further include a pair of linearsymmetrical internal antenna patterns surrounding a region in which theinternal connection pad groups are disposed, and one of the internalconnection pad groups may further include another internal connectionpad configured to electrically connect one of the chip pads and theinternal antenna patterns.

One of the internal connection pad groups may include two internalconnection pads formed respectively on left and right sides of the innersurface so as to wire-bond the internal antenna patterns and one of thechip pads.

The internal circuit pattern may further include a pair ofvertically-symmetrical external antenna pads disposed outside aperiphery of a region in which the internal connection pad groups aredisposed, and one of the internal connection pad groups may furtherinclude: another internal connection pad configured to electricallyconnect one of the chip pads and the external antenna pads; and aconnection line configured to connect the internal connection pad andthe external antenna pads.

The smart card may further include an external antenna buried in thecard body to contact with the external antenna pads.

The external circuit pattern may further include a pair of externalantenna pads symmetrically formed outside the external contact pads, andone of the internal connection pads may be electrically connected to theexternal antenna pads by a connection via connecting the externalantenna pads and the internal contact pads.

The external circuit pattern may include eight external contact padsdefined in the ISO 7816-2 standard, and the internal circuit pattern mayinclude a plurality of the internal connection pad groups disposedcorresponding to at least the eight external contact pads.

The edge-pad type IC chip is advantageous in that it can be connected bywire bonding. The center-pad type IC chip is advantageous in that it canbe relatively reduced in size. The reason for this is that the widestpattern, that is, a power pattern and a ground pattern must be disposedat all four sides of the edge-pad type IC chip, but is disposed at onlya center portion of the center-pad type IC chip. However, the center-padtype IC chip is disadvantageous in that it requires dedicated assemblyequipment. The invention is suitable for both types of IC chips and thusis capable of utilizing the advantages of either or both types.

Accordingly, the universal PCB can be used suitably for the variouspositions of the chip pads, regardless of the size, type and bondingstructure of the IC chip. Consequently, it is possible to producevarious smart cards in bulk or mass, thereby reducing the manufacturingcost thereof.

While the invention has been particularly shown and described withreference to exemplary embodiments thereof, it will be understood bythose of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit and scopeof the invention as defined by the following claims.

1. A universal PCB (printed circuit board) for a smart card, comprising:a board body comprising an inner surface and an outer surface oppositeto the inner surface; an internal circuit pattern formed on the innersurface, the internal circuit pattern comprising a plurality of internalconnection pad groups each comprising: internal connection pads disposedon the inner surface so as to be electrically connected to chip pads ofan IC chip regardless of a change in positions of the chip pads; and aninternal connection line connecting the internal connection pads; anexternal circuit pattern comprising a plurality of external contact padsformed on the outer surface; and connection vias penetrating the boardbody to connect at least one of the external contact pads and at leastone of the internal connection pad groups, wherein at least one of theinternal connection pads is located to correspond to the chip padposition on the IC chip when the IC chin is flip-chip-bonded to theinternal circuit pattern, and wherein at least one of the chip pads is acenter pad located at a center portion of the IC chip, and at least oneof the internal connection pads is located at a center portion of theinternal circuit pattern so as to correspond to the center pad.
 2. Theuniversal PCB of claim 1, wherein at least one of the internalconnection pads is located outside a periphery of the IC chip when theIC chip is wire-bonded to the internal circuit pattern.
 3. The universalPCB of claim 1, wherein the internal circuit pattern further comprises apair of linear symmetrical internal antenna patterns surrounding aregion in which the internal connection pad groups are disposed.
 4. Theuniversal PCB of claim 3, wherein at least one of the internalconnection pad groups comprises another internal connection padconfigured to electrically connect at least one of the chip pads and atleast one of the internal antenna patterns.
 5. The universal PCB ofclaim 3, wherein at least one of the internal connection pad groupscomprises two internal connection pads disposed on left and right sidesof the inner surface so as to allow electrical connection of at leastone of the internal antenna patterns and at least one of the chip pads.6. The universal PCB of claim 1 wherein at least one of the internalconnection pad groups further comprises: an internal antenna connectionpad configured to electrically connect at least one of the chip pads andat least one of a pair of vertically-symmetrical the external antennapads; and a connection line configured to connect the internal antennaconnection pad and at least one of the external antenna pads.
 7. Theuniversal PCB of claim 1, wherein the external circuit pattern includeseight external contact pads, and the internal circuit pattern includes aplurality of the internal connection pad groups disposed correspondingto at least the eight external contact pads.
 8. A universal PCB (printedcircuit board) for a smart card, comprising: a board body comprising aninner surface and an outer surface opposite to the inner surface; aninternal circuit pattern formed on the inner surface, the internalcircuit pattern comprising a plurality of internal connection pad groupseach comprising: internal connection pads disposed on the inner surfaceso as to be electrically connected to chip pads of an IC chip regardlessof a change in positions of the chip pads; and an internal connectionline connecting the internal connection pads; an external circuitpattern comprising a plurality of external contact pads formed on theouter surface; and connection vias penetrating the board body to connectat least one of the external contact pads and at least one of theinternal connection pad groups, wherein the internal circuit patternfurther comprises a pair of vertically-symmetrical external antenna padsdisposed outside a periphery of a region in which the internalconnection pad groups are disposed, and wherein the external circuitpattern further comprises a pair of external antenna contact padssymmetrically formed outside of a periphery of a region in which theexternal contact pads are disposed, and at least one of thevertically-symmetrical external antenna pads is electrically connectedto at least one of the external antenna contact pads by a connectionvia.
 9. A universal PCB (printed circuit board) for a smart card,comprising: a PCB comprising an inner surface and an outer surfaceopposite to the inner surface; an internal circuit pattern formed on theinner surface, the internal circuit pattern comprising a plurality ofinternal connection pad groups each comprising: a first internalconnection pad located outside a periphery of an IC chip when the ICchip is wire-bonded to the internal circuit pattern; a second internalconnection pad located to correspond with a chip pad when the IC chip isflip-chip-bonded to the internal circuit pattern; and an internalconnection line connecting the first and second internal connectionpads; an external circuit pattern comprising external contact padsformed on the outer surface; and connection vias penetrating the PCB toconnect at least one of the external contact pads and at least one ofthe internal connection pad groups, wherein the chip pad is a center padlocated at a center portion of the IC chip, and the second internalconnection pad is located at a center portion of the internal circuitpattern so as to correspond to the center pad.
 10. The universal PCB ofclaim 9, wherein the internal circuit pattern further comprises a pairof linear symmetrical internal antenna patterns surrounding a region inwhich the internal connection pad groups are disposed, wherein at leastone of the internal connection pad groups further comprises an internalantenna connection pad configured to electrically connect at least oneof the chip pads and at least one of the internal antenna patterns. 11.The universal PCB of claim 10, wherein at least one of the internalconnection pad groups includes two internal connection pads formedrespectively on left and right sides of the inner surface so as to allowelectrical connection of at least one of the internal antenna patternsand at least one of the chip pads.
 12. The universal PCB of claim 9,wherein the internal circuit pattern further comprises a pair ofvertically-symmetrical external antenna pads disposed outside aperiphery of a region in which the internal connection pad groups aredisposed, and at least one of the internal connection pad groups furthercomprises: an internal antenna connection pad configured to electricallyconnect at least one of the chip pads and at least one of the externalantenna pads; and a connection line configured to connect the internalantenna connection pad and at least one of the external antenna pads.13. A universal PCB (printed circuit board) for a smart card,comprising: a PCB comprising an inner surface and an outer surfaceopposite to the inner surface; an internal circuit pattern formed on theinner surface, the internal circuit pattern comprising a plurality ofinternal connection pad groups each comprising: a first internalconnection pad located at an edge portion of an IC chip when the IC chipis mounted to the PCB; a second internal connection pad located tocorrespond with a chip pad located at a center portion of the IC chipwhen the IC chip is flip-chip bonded to the internal circuit pattern;and an internal connection line connecting the first and second internalconnection pads; an external circuit pattern comprising external contactpads formed on the outer surface; and connection vias penetrating thePCB to connect at least one of the external contact pads and at leastone of the internal connection pad groups.
 14. The universal PCB ofclaim 13, wherein the first internal connection pad comprises: aninternal wire-bonding connection pad located outside a periphery of theIC chip when the IC chip is wire-bonded to the internal circuit pattern;and an internal flip-chip-bonding connection pad disposed to correspondto at least one of the chip pads when the IC chip is flip-chip-bonded tothe internal circuit pattern.
 15. A universal PCB (printed circuitboard) for a smart card, comprising: a PCB comprising an inner surfaceand an outer surface opposite to the inner surface; an internal circuitpattern disposed on the inner surface, the internal circuit patterncomprising: a plurality of internal connection pad groups eachcomprising: a first internal connection pad located at an edge portionof an IC chip when the IC chip is mounted to the PCB; a second internalconnection pad disposed to correspond with a chip pad located at acenter portion of the IC chip when the IC chip is flip-chip bonded tothe internal circuit pattern; a third internal connection pad disposedto correspond with a chip pad located at an edge portion of the IC chipwhen the IC chip is flip-chip bonded to the internal circuit pattern;and an internal connection line connecting the first, second, and thirdinternal connection pads; a pair of vertically-symmetrical externalantenna pads disposed outside a periphery of a region in which theinternal connection pad groups are disposed, wherein at least one of theinternal connection pad groups further comprises: an internal antennaconnection pad configured to electrically connect at least one of thechip pads and at least one of the external antenna pads; and aconnection line configured to connect the internal antenna connectionpad and at least one of the external antenna pads; a pair of linearsymmetrical internal antenna patterns surrounding a region in which theinternal connection pad groups are disposed; and another internalantenna connection pad configured to electrically connect at least oneof the chip pads and at least one of the internal antenna patterns; anexternal circuit pattern comprising external contact pads disposed onthe outer surface; and connection vias penetrating the PCB to connect atleast one of the external contact pads and at least one of the internalconnection pad groups.